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LTL307JGD-041A データシート(PDF) 9 Page - Lite-On Technology Corporation |
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LTL307JGD-041A データシート(HTML) 9 Page - Lite-On Technology Corporation |
9 / 12 page LITE-ON TECHNOLOGY CORPORATION. P r o p e r t y o f L i t e - O n O n l y CAUTIONS 1. Application The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 2. Storage The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 3. Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary. 4. Lead Forming & Assembly During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress. 5. Soldering When soldering, For Lamp without stopper type and must be leave a minimum of 2mm clearance from the base of the lens to the soldering point. To avoided the Epoxy climb up on lead frame and was impact to non-soldering problem, Dipping the lens into the solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering conditions : Soldering iron Wave soldering Temperature Soldering time 350°C Max. 3 sec. Max. (one time only) Pre-heat Pre-heat time Solder wave Soldering time 100°C Max. 60 sec. Max. 260°C Max. 5 sec. Max. Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of the LED. IR reflow is not suitable process for through hole type LED lamp product. Part No. : LTL307JGD-041A Page : 8 of 11 BNS-OD-C131/A4 |
同様の部品番号 - LTL307JGD-041A |
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同様の説明 - LTL307JGD-041A |
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