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74AHCT2G126 データシート(PDF) 2 Page - NXP Semiconductors |
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74AHCT2G126 データシート(HTML) 2 Page - NXP Semiconductors |
2 / 20 page 9397 750 13736 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data sheet Rev. 02 — 21 September 2004 2 of 20 Philips Semiconductors 74AHC2G126; 74AHCT2G126 Dual buffer/line driver; 3-state [1] CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total load switching outputs; Σ(CL × VCC2 × fo) = sum of the outputs. [2] The condition is VI = GND to VCC. 4. Ordering information Type 74AHCT2G126 tPHL, tPLH propagation delay nA to nY CL = 15 pF; VCC = 5 V - 3.4 5.5 ns CI input capacitance - 1.5 10 pF CPD power dissipation capacitance CL = 50 pF; fi = 1 MHz [1] [2] -10 - pF Table 1: Quick reference data …continued GND = 0 V; Tamb = 25 °C; tr = tf ≤ 3.0 ns. Symbol Parameter Conditions Min Typ Max Unit Table 2: Ordering information Type number Package Temperature range Name Description Version 74AHC2G126DP −40 °C to +125 °C TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 74AHCT2G126DP −40 °C to +125 °C TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 74AHC2G126DC −40 °C to +125 °C VSSOP8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 74AHCT2G126DC −40 °C to +125 °C VSSOP8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 74AHC2G126GM −40 °C to +125 °C XSON8 plastic extremely thin small outline package; no leads; 8 terminals; body 0.95 × 1.95 × 0.5 mm SOT833-1 74AHCT2G126GM −40 °C to +125 °C XSON8 plastic extremely thin small outline package; no leads; 8 terminals; body 0.95 × 1.95 × 0.5 mm SOT833-1 |
同様の部品番号 - 74AHCT2G126 |
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同様の説明 - 74AHCT2G126 |
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