NCV51460

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10

The peaks which are visible on the noise spectrum are

reflecting the stability of the NCV51460 device. In the

comparison in Figure 31 it can be noticed that 0

mF and

10

mF cases represents the best stability.

Thermal Characteristics

As power dissipation in the NCV51460 increases, it may

become necessary to provide some thermal relief. The

maximum power dissipation supported by the device is

dependent upon board design and layout. The board material

and the ambient temperature affect the rate of junction

temperature rise for the part. The maximum power

dissipation the NCV51460 can handle is given by:

P

[T

(eq. 1)

then the NCV51460 can dissipate up to 305 mW when the

°C.

The power dissipated by the NCV51460 can be calculated

from the following equations:

P

(eq. 2)

or

V

P

I

(eq. 3)

PCB Layout Recommendations

wide as possible. When the impedance of these traces is

high, there is a chance to pick up noise and cause the

regulator to malfunction. Place external components,

especially the output capacitor, as close as possible to the

NCV51460, and make traces as short as possible.

ORDERING INFORMATION

Device

Marking

Package

NCV51460SN33T1G

JJ

SOT−23

(Pb−Free)

3,000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specification Brochure, BRD8011/D.