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MC34921 データシート(PDF) 7 Page - List of Unclassifed Manufacturers |
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MC34921 データシート(HTML) 7 Page - List of Unclassifed Manufacturers |
7 / 36 page Analog Integrated Circuit Device Data Freescale Semiconductor 7 34921 MAXIMUM RATINGS THERMAL RATINGS Operating Temperature Ambient Junction TA TJ -20 to 85 150 °C Storage Temperature TSTG -55 to 150 °C Thermal Resistance Junction to Ambient(3) Junction to Board(4) Junction to Case RθJA RθJB RθJC 40 14 <1.0 °C/W Peak Package Reflow Temperature During Solder Mounting (5) TSOLDER 245 °C THERMAL RESISTANCE AND PACKAGE DISSIPATION RATINGS Power Dissipation (TA = 25° C) (6) PD 2.0 W Notes 3. 1s PCB test board JESD51-2 and SEMI G38-87. 4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured at the package center lead foot. 2s2p test board, exposed pad soldered to PCB. 5. Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 6. Maximum power dissipation at indicated ambient temperature in free air with no heatsink used. Table 2. Maximum Ratings(continued) All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Rating Symbol Max Unit |
同様の部品番号 - MC34921 |
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同様の説明 - MC34921 |
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