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SPI-8010A データシート(PDF) 6 Page - Allegro MicroSystems

部品番号 SPI-8010A
部品情報  3 A, DC/DC Step-Down Converter
Download  9 Pages
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メーカー  ALLEGRO [Allegro MicroSystems]
ホームページ  http://www.allegromicro.com
Logo ALLEGRO - Allegro MicroSystems

SPI-8010A データシート(HTML) 6 Page - Allegro MicroSystems

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SPI-8010A
3 A, DC/DC
Step-Down Converter
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036
Switching
Regulators
6
APPLICATIONS INFORMATION (cont.)
Soft-Start Capcitor (C4). Soft start is enabled by
connecting a capacitor between terminal 4 and ground. The
device may be turned off (chip enable) by decreasing the
terminal 4 voltage below 0.5 V with either an npn small-
signal transistor or the output of open-collector TTL. If
both a large soft-start capacitor and chip on/off control are
desired, collector current limiting must be used to prevent
transistor damage. No external voltage can be applied to
terminal 4.
Overcurrent Protection. The SPI-8000A series has a
built-in fold-back type overcurrent protection circuit, which
limits the output current at a start-up mode. It thus cannot
be used in applications that require current at the start-up
mode such as:
(1) constant-current load,
(2) power supply with positive and negative outputs to
common load (a center-tap type power supply), or
(3) raising the output voltage by putting a diode or a
resistor between the device ground and system ground.
Parallel Operation. Parallel operation to increase load
current is not permitted.
Thermal Protection. Circuitry turns off the device
when the junction temperature rises above 170°C. It is
intended only to protect the device from failures due to
excessive junction temperatures and should not imply that
output short circuits or continuous overloads are permitted.
Heat Radiation and Reliability. The reliability of the
IC is directly related to the junction temperature (T
J) in its
operation. Accordingly, careful consideration should be
given to heat dissipation.
The inner frame on which the integrated circuit is mounted
is connected to the exposed pad. Therefore, it is very
effective for heat radiation to enlarge the copper area that is
connected to the pad. The graph on page 2 illustrates the
effect of the copper area on the junction-to-ambient thermal
resistance (RθJA).
The junction temperature (T
J) can be determined from
either of the following equations:
T
J = (PDR
θJA) + TA
or
T
J = (PDR
θJL) + TL
where P
D = VIII – VOIO – VFIO(1 – [VO/VI]),
V
F = the Schottky diode forward voltage, and
RθJL = 18°C/W.
Layout Guideline


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