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Notes

A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.

B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.

C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled

to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp

Gain Equalizer Die

50Ω

12dB

DC to 20 GHz

Microwave

Pad Number

Function

Description

2

RF-IN

RF-Input pad

5

RF-OUT

RF-Output pad

1,3,4,6

GND

Ground

Product Features

• 11.9 dB Slope

• Wide Bandwidth, DC-20 GHz

• Excellent Return Loss, 20 dB typ.

General Description

EQY-12-24-D+ is an absorptive Gain Equalizer Die fabricated using highly repetitive GaAs IPD MMIC

process incorporating resistors, capacitors and inductors having negative insertion loss slope.

EQY-12-24-D+ has a nominal attenuation slope of 11.9 dB.

EQY-12-24-D+

Simplified Schematic and Pad description

Bonding Pad Position

Dimensions in µm, Typical

L1

L2

L3

L4

L5

H1

H2

H3

H4

Thickness Die Size

Bond Pad

#1, #3, #4, #6

Bond Pad

#2, #5

95

108

643

649

750

185

385

585

825

100

750x825

92 X 92

117 X 142

+RoHS Compliant

The +Suffix identifies RoHS Compliance. See our web site

for RoHS Compliance methodologies and qualifications

Ordering Information: Refer to Last Page

Typical Applications

• Fixed Satellite

• Mobile

• Radio location

• Space research

REV. OR

M171290

EQY-12-24-D+

GY/RS/CP/AM

190123

Bonding Pad Position / Description

Die Dimensions in um

L1 L2

L3

L4

L5

H1 H2 H3

H4

95 108 643 649 750 185 385 585 825

Thickness

Die Size

Bond Pad #1, #3, #4, #6

Bond Pad #2, #5

100

750 x 825

92 x 92

117 x 142

Pad #

Description

1,3,4,6

Ground

2

Input

5

Output

L1

L3

L5

L4

H4

H3

H2

H1

L2

3

0

4

0

2

5

1

6

RF-IN

RF-OUT