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74FST3245DT データシート(PDF) 7 Page - ON Semiconductor |
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74FST3245DT データシート(HTML) 7 Page - ON Semiconductor |
7 / 8 page 74FST3245 http://onsemi.com 7 PACKAGE DIMENSIONS QSOP–20 QS SUFFIX CASE 492A–01 ISSUE O MIN MILLIMETERS G R –B– –A– L M 0.25 (0.010) T U –T– SEATING PLANE K D 20 PL C M 0.25 (0.010) T BA S S V N M F 8 PL DETAIL E DETAIL E H x 45 _ RAD. MOLD PIN DIM MAX MIN MAX INCHES A 8.56 8.74 0.337 0.344 B 3.81 3.99 0.150 0.157 C 1.55 1.73 0.061 0.068 D 0.20 0.31 0.008 0.012 F 0.41 0.89 0.016 0.035 G 0.64 BSC 0.025 BSC H 0.20 0.46 0.008 0.018 J 0.249 0.191 0.0098 0.0075 K 0.10 0.25 0.004 0.010 L 5.84 6.20 0.230 0.244 M 0 8 0 8 N 0 7 0 7 P 1.32 1.58 0.052 0.062 Q 0.89 DIA 0.035 DIA R 0.89 1.14 0.035 0.045 U 0.89 1.14 0.035 0.045 V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. THE BOTTOM PACKAGE SHALL BE BIGGER THAN THE TOP PACKAGE BY 4 MILS (NOTE: LEAD SIDE ONLY). BOTTOM PACKAGE DIMENSION SHALL FOLLOW THE DIMENSION STATED IN THIS DRAWING. 4. PLASTIC DIMENSIONS DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 6 MILS PER SIDE. 5. BOTTOM EJECTOR PIN WILL INCLUDE THE COUNTRY OF ORIGIN (COO) AND MOLD CAVITY I.D. __ _ _ 0 8 0 __ _ 8 _ __ __ MARK Q P 0.013 X 0.005 DP. MAX RAD. 0.005–0.010 TYP J |
同様の部品番号 - 74FST3245DT |
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同様の説明 - 74FST3245DT |
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