データシートサーチシステム |
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OPA191 データシート(PDF) 6 Page - Texas Instruments |
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OPA191 データシート(HTML) 6 Page - Texas Instruments |
6 / 53 page 6 OPA191, OPA2191, OPA4191 SBOS701B – DECEMEBER 2015 – REVISED JULY 2019 www.ti.com Product Folder Links: OPA191 OPA2191 OPA4191 Submit Documentation Feedback Copyright © 2015–2019, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information: OPA191 THERMAL METRIC(1) OPA191 UNIT D (SOIC) DGK (VSSOP) DBV (SOT) 8 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 115.8 180.4 158.8 °C/W RθJC(top) Junction-to-case(top) thermal resistance 60.1 67.9 60.7 °C/W RθJB Junction-to-board thermal resistance 56.4 102.1 44.8 °C/W ψJT Junction-to-top characterization parameter 12.8 10.4 1.6 °C/W ψJB Junction-to-board characterization parameter 55.9 100.3 4.2 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.5 Thermal Information: OPA2191 THERMAL METRIC(1) OPA2191 UNIT D (SOIC) DGK (VSSOP) 8 PINS RθJA Junction-to-ambient thermal resistance 107.9 158 °C/W RθJC(top) Junction-to-case(top) thermal resistance 53.9 48.6 °C/W RθJB Junction-to-board thermal resistance 48.9 78.7 °C/W ψJT Junction-to-top characterization parameter 6.6 3.9 °C/W ψJB Junction-to-board characterization parameter 48.3 77.3 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.6 Thermal Information: OPA4191 THERMAL METRIC(1) OPA4191 UNIT D (SOIC) PW (TSSOP) RUM (QFN) 14 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 86.4 108.1 33.0 °C/W RθJC(top) Junction-to-case(top) thermal resistance 46.3 26.3 25.1 °C/W RθJB Junction-to-board thermal resistance 41.0 54.4 11.6 °C/W ψJT Junction-to-top characterization parameter 11.3 1.4 0.2 °C/W ψJB Junction-to-board characterization parameter 40.7 53.3 11.5 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A 2.6 °C/W |
同様の部品番号 - OPA191_V01 |
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同様の説明 - OPA191_V01 |
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