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ADD8701ACP データシート(PDF) 3 Page - Analog Devices

部品番号 ADD8701ACP
部品情報  12-Channel Gamma Buffers with VCOM Buffer
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メーカー  AD [Analog Devices]
ホームページ  http://www.analog.com
Logo AD - Analog Devices

ADD8701ACP データシート(HTML) 3 Page - Analog Devices

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REV. 0
ADD8701
–3–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADD8701 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
PIN CONFIGURATION
PIN 1
INDICATOR
TOP VIEW
24 GND
23 VDD
22 V6
21 V5
VDD 1
VCOM IN 2
IN12 3
20 V4
19 V3
18 V2
17 V1
IN11 4
IN10 5
IN9 6
IN8 7
IN7 8
ADD8701
ABSOLUTE MAXIMUM RATINGS
*
Supply Voltage (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to VDD + 0.5 V
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Operating Temperature Range . . . . . . . . . . . . –40°C to +85°C
Junction Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering, 60 sec) . . . . . . . . 300°C
ESD Tolerance (HBM) . . . . . . . . . . . . . . . . . . . . . . . ±1,000 V
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
ORDERING GUIDE
Model
Temperature
Package
Package
Range
Description
Option
ADD8701ACP
–40°C to +85°C
32-Lead LFCSP CP-32
Package Type
JA
1
JB
2
Unit
32-Lead LFCSP (CP)
35
13
°C/W
NOTES
1
θ
JA is specified for worst-case conditions, i.e.,
θ
JA is specified for device soldered
in circuit board for surface-mount packages.
2
ψ
JB is applied for calculating the junction temperature by reference to the board
temperature.
PIN FUNCTION DESCRIPTION
Pin No.
Mnemonic
Description
1, 15, 23
VDD
Power (+)
2
VCOM IN
VCOM Buffer Input
3–14
IN12–IN1
Gamma Buffer Inputs
16, 24, 31
GND
Power (–)
17–22, 25–30
V1–V12
Gamma Buffer Outputs
32
VCOM OUT
VCOM Buffer Output


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