MC10EP29, MC100EP29

http://onsemi.com

8

PACKAGE DIMENSIONS

TSSOP–20

DT SUFFIX

PLASTIC TSSOP PACKAGE

CASE 948E–02

ISSUE A

DIM

A

MIN

MAX

MIN

MAX

INCHES

6.60

0.260

MILLIMETERS

B

4.30

4.50

0.169

0.177

C

1.20

0.047

D

0.05

0.15

0.002

0.006

F

0.50

0.75

0.020

0.030

G

0.65 BSC

0.026 BSC

H

0.27

0.37

0.011

0.015

J

0.09

0.20

0.004

0.008

J1

0.09

0.16

0.004

0.006

K

0.19

0.30

0.007

0.012

K1

0.19

0.25

0.007

0.010

L

6.40 BSC

0.252 BSC

M

0

8

0

8

_

___

110

11

20

PIN 1

IDENT

A

B

–T–

0.100 (0.004)

C

D

G

H

SECTION N–N

K

K1

JJ1

N

N

M

F

–W–

SEATING

PLANE

–V–

–U–

S

U

M

0.10 (0.004)

T

20X

REF

K

L

L/2

2X

S

U

0.15 (0.006) T

DETAIL E

0.25 (0.010)

DETAIL E

6.40

0.252

---

---

S

U

0.15 (0.006) T

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. ICONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED 0.25 (0.010)

PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

EXCESS OF THE K DIMENSION AT MAXIMUM

MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE -W-.

ON Semiconductor and

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changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any

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liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be

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MC10EP29/D

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