データシートサーチシステム |
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CBZX55C16 データシート(PDF) 3 Page - Cystech Electonics Corp. |
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CBZX55C16 データシート(HTML) 3 Page - Cystech Electonics Corp. |
3 / 3 page CYStech Electronics Corp. Spec. No. : C326LC Issued Date : 2003.05.20 Revised Date : Page No. : 3/3 CBZX55CXXLC series CYStek Product Specification DO-35(Glass) Dimension *:Typical Inches Millimeters Inches Millimeters DIM Min. Max. Min. Max. DIM Min. Max. Min. Max. A φ0.0181 φ0.0220 φ0.46 φ0.56 D 0.9646 1.2811 24.50 32.54 B 0.9646 1.2811 24.50 32.54 E φ0.0602 φ0.0787 φ1.53 φ2.00 C 0.1200 0.1700 3.05 4.20 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. A B C D DO-35 glass package, CYStek package code: LC B C D A E |
同様の部品番号 - CBZX55C16 |
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同様の説明 - CBZX55C16 |
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