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AD5522JSVUZ データシート(PDF) 11 Page - Analog Devices

部品番号 AD5522JSVUZ
部品情報  Quad Parametric Measurement Unit With Integrated 16-Bit Level Setting DACs
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メーカー  AD [Analog Devices]
ホームページ  http://www.analog.com
Logo AD - Analog Devices

AD5522JSVUZ データシート(HTML) 11 Page - Analog Devices

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Preliminary Technical Data
AD5522
Rev. PrL | Page 11 of 45
ABSOLUTE MAXIMUM RATINGS
Table 3. AD5522 Absolute Maximum Ratings
Parameter
Rating
Supply Voltage AVDD to AVSS
34V
AVDD to AGND
-0.3V to 34V
AVSS to AGND
0.3V to -34V
VREF to AGND
-0.3 V, +7V
DUTGND, REFGND, AGND
AVDD +0.3V to AVSS -0.3V
DVCC to DGND
- 0.3V to 7V
Digital Inputs to DGND
- 0.3V to DVCC +0.3V
Analog Inputs to AGND
AVSS - 0.3V to AVDD +0.3V
Storage Temperature
–65°C to +125°C
Operating Junction Temperature
+25 to +90°C
Reflow Soldering
Peak Temperature
230°C
Time at Peak Temperature
10s to 40s
Junction Temperature
150°C max
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other condition s above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE3
Thermal resistance values are specified for the worst-case
conditions, i.e., specified for device soldered in circuit board for
surface mount packages.
Table 4. Thermal Resistance (JEDEC 4 layer (1S2P) board)
Air Flow (LFPM)
0
200
500
Unit
TQFP Exposed Pad Down
θ
JA
22.3
17.2
15.1
°C/W
θ
JC
0.3
°C/W
TQFP Exposed Pad Up
θ
JA
TBD
TBD
TBD
°C/W
θ
JC
4.8
°C/W
Table 5. Thermal Resistance (JEDEC 4 layer (1S2P) board
with cooling plate4 at 45°C, natural convection at 55°C
ambient)
Package Thermals
θ
JA
θ
JA
Unit
TQFP Exposed Pad Down
5.4
4.8
°C/W
TQFP Exposed Pad Up
3.0
0.3
°C/W
3 Simulated Thermal information.
4 Assumes perfect thermal contact between cooling plate and exposed
paddle
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.


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