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TPA6110A2DGNRG4 データシート(PDF) 2 Page - Texas Instruments |
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TPA6110A2DGNRG4 データシート(HTML) 2 Page - Texas Instruments |
2 / 20 page www.ti.com ABSOLUTE MAXIMUM RATINGS (1) DISSIPATION RATING TABLE TPA6110A2 SLOS314A – DECEMBER 2000 – REVISED SEPTEMBER 2004 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. AVAILABLE OPTIONS PACKAGED DEVICE TA MSOP SYMBOLIZATION MSOP(1) -40 °C to 85°C TPA6110A2DGN TI AIZ (1) The DGN package is available inleft-ended tape and reel only (e.g., TPA6110A2DGNR). Terminal Functions TERMINAL I/O DESCRIPTION NAME NO. BYPASS 1 I Tap to voltage divider for internal mid-supply bias supply. Connect to a 0.1 µF to 1 µF low ESR capacitor for best performance. GND 2 I GND is the ground connection. IN1– 8 I IN1– is the inverting input for channel 1. IN2– 4 I IN2– is the inverting input for channel 2. SHUTDOWN 3 I Puts the device in a low quiescent current mode when held high. VDD 6 I VDD is the supply voltage terminal. VO1 7 O VO1 is the audio output for channel 1. VO2 5 O VO2 is the audio output for channel 2. over operating free-air temperature range (unless otherwise noted) UNIT VDD Supply voltage 6 V VI Input voltage –0.3 V to VDD + 0.3 V Continuous total power dissipation Internally limited TJ Operating junction temperature range -40 °C to 150°C Tstg Storage temperature range -65 °C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °C (1) Stresses beyond those listedunder "absolute maximum ratings” may cause permanent damage to thedevice. These are stress ratings only, and functional operation of the deviceat these or any other conditions beyond those indicated under "recommendedoperating conditions” is not implied. Exposure to absolute-maximum-ratedconditions for extended periods may affect devicereliability. TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C PACKAGE POWER RATING ABOVE TA = 25°C POWER RATING POWER RATING DGN 2.14 W(1) 17.1 mW/ °C 1.37 W 1.11 W (1) See the Texas Instrumentsdocument, PowerPAD Thermally EnhancedPackage Application Report (SLMA002), for more information on thePowerPAD™ package. The thermal data was measured on a PCB layout based onthe information in the section entitled Texas Instruments Recommended Board for PowerPAD onpage 33 of the before mentioned document. 2 |
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同様の説明 - TPA6110A2DGNRG4 |
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