www.ti.com

FEATURES

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

IN1

SGND

SVRR

OUT1

PGND

OUT2

M/SB

IN2

GND/HS

GND/HS

GND/HS

GND/HS

GND/HS

GND/HS

GND/HS

GND/HS

GND/HS

GND/HS

GND/HS

NE PACKAGE

(TOP VIEW)

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

GND/HS

IN1

NC

SGND

SVRR

NC

OUT1

OUT1

PGND

GND/HS

GND/HS

IN2

NC

M/SB

NC

OUT2

OUT2

PGND

GND/HS

DWP PACKAGE

(TOP VIEW)

Cross Section View Showing PowerPAD

NC – No internal connection

DESCRIPTION

TPA1517

SLOS162D – MARCH 1997 – REVISED FEBRUARY 2007

6-W STEREO AUDIO POWER AMPLIFIER

• Thermal Protection

• TDA1517P Compatible

• Fixed Gain: 20 dB

• High Power Outputs (6 W/Channel)

• Mute and Standby Operation

• Surface Mount Availability 20-Pin Thermal

• Supply Range: 9.5 V - 18 V

SOIC PowerPAD™

The TPA1517 is a stereo audio power amplifier that contains two identical amplifiers capable of delivering 6 W

per channel of continuous average power into a 4-

Ω load at 10% THD+N or 5 W per channel at 1% THD+N.

The gain of each channel is fixed at 20 dB. The amplifier features a mute/standby function for power-sensitive

applications. The amplifier is available in the PowerPAD™ 20-pin surface-mount thermally-enhanced package

(DWP) that reduces board space and facilitates automated assembly while maintaining exceptional thermal

characteristics. It is also available in the 20-pin thermally enhanced DIP package (NE).

AVAILABLE OPTIONS

THERMALLY ENHANCED

THERMALLY ENHANCED

PLASTIC DIP

-40

°C to 85°C

TPA1517NE

(1)

For the most current package and ordering information, see the Package Option Addendum at the end

of this document, or see the TI Web site at www.ti.com.

(2)

The DWP package is available taped and reeled. To order a taped and reeled part, add the suffix R

(e.g., TPA1517DWPR).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 1997–2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.