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ISL24006IRZ-T13 データシート(PDF) 9 Page - Intersil Corporation |
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ISL24006IRZ-T13 データシート(HTML) 9 Page - Intersil Corporation |
9 / 10 page 9 FN6110.1 March 9, 2006 The maximum power dissipation allowed in a package is determined according to: where: •TJMAX = Maximum junction temperature •TAMAX = Maximum ambient temperature • θJA = Thermal resistance of the package •PDMAX = Maximum power dissipation in the package The maximum power dissipation actually produced by the IC is the total quiescent supply current times the total power supply voltage and plus the power in the IC due to the loads. when sourcing, and: when sinking. Where: • i = 1 to total 14 •AVDD = Supply voltage •IAVDD = Quiescent current •VOUTi = Output voltage of the i channel •ILOADi = Load current of the i channel By setting the two PDMAX equations equal to each other, we can solve for the RLOADs to avoid the device overheat. The package power dissipation curves provide a convenient way to see if the device will overheat. Power Supply Bypassing and Printed Circuit Board Layout Good printed circuit board layout is necessary for optimum performance. A low impedance and clean analog ground plane should be used for the ISL24006. The traces from the two ground pins to the ground plane must be very short. The thermal pad should be connected to the analog ground plane. Lead length should be as short as possible and all power supply pins must be well bypassed. A 0.1µF ceramic capacitor must be placed very close to the AVDD, VREFU_H, VREFU_L, VREFL_H, VREFL_L, and BG pins. A 4.7µF local bypass ceramic capacitor should be placed to the AVDD, VREFU_H, VREFU_L, VREFL_H, VREFL_L pins. PDMAX TJMAX TAMAX – Θ JA --------------------------------------------- = PDMAX AVDD IAVDD Σ A ( [ VDD VOUTi) ILOADi × – ] + × = PDMAX AVDD IAVDD Σ VOUTiILOADi × () + × = ISL24006 |
同様の部品番号 - ISL24006IRZ-T13 |
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同様の説明 - ISL24006IRZ-T13 |
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