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ISL28291FRUZ-T7 データシート(PDF) 10 Page - Intersil Corporation |
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ISL28291FRUZ-T7 データシート(HTML) 10 Page - Intersil Corporation |
10 / 14 page 10 FN6156.2 Power Supply Bypassing and Printed Circuit Board Layout As with any high frequency device, good printed circuit board layout is necessary for optimum performance. Low impedance ground plane construction is essential. Surface mount components are recommended, but if leaded components are used, lead lengths should be as short as possible. The power supply pins must be well bypassed to reduce the risk of oscillation. The combination of a 4.7µF tantalum capacitor in parallel with a 0.01µF capacitor has been shown to work well when placed at each supply pin. For good AC performance, parasitic capacitance should be kept to a minimum, especially at the inverting input. When ground plane construction is used, it should be removed from the area near the inverting input to minimize any stray capacitance at that node. Carbon or Metal-Film resistors are acceptable with the Metal-Film resistors giving slightly less peaking and bandwidth because of additional series inductance. Use of sockets, particularly for the SO package, should be avoided if possible. Sockets add parasitic inductance and capacitance which will result in additional peaking and overshoot. ISL28191, ISL28291 |
同様の部品番号 - ISL28291FRUZ-T7 |
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同様の説明 - ISL28291FRUZ-T7 |
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