データシートサーチシステム |
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ISL21007DFB812Z データシート(PDF) 2 Page - Intersil Corporation |
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ISL21007DFB812Z データシート(HTML) 2 Page - Intersil Corporation |
2 / 14 page 2 FN6326.1 April 12, 2007 Ordering Information PART NUMBER (Note) PART MARKING VOUT OPTION (V) GRADE TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # ISL21007BFB812Z 21007BF Z12 1.250 ±0.5mV, 3ppm/°C -40 to +125 8 Ld SOIC M8.15 ISL21007CFB812Z 21007CF Z12 1.250 ±1.0mV, 5ppm/°C -40 to +125 8 Ld SOIC M8.15 ISL21007DFB812Z 21007DF Z12 1.250 ±2.0mV, 10ppm/°C -40 to +125 8 Ld SOIC M8.15 ISL21007BFB825Z 21007BF Z25 2.500 ±0.5mV, 3ppm/°C -40 to +125 8 Ld SOIC M8.15 ISL21007CFB825Z 21007CF Z25 2.500 ±1.0mV, 5ppm/°C -40 to +125 8 Ld SOIC M8.15 ISL21007DFB825Z 21007DF Z25 2.500 ±2.0mV, 10ppm/°C -40 to +125 8 Ld SOIC M8.15 NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. *Add “-TK” suffix for tape and reel ISL21007 |
同様の部品番号 - ISL21007DFB812Z |
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同様の説明 - ISL21007DFB812Z |
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