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ST14C02C データシート(PDF) 2 Page - STMicroelectronics |
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ST14C02C データシート(HTML) 2 Page - STMicroelectronics |
2 / 13 page 2/13 MICROMODULES The assembly flows is as follows: 1. Dice sawing 2. Dice attach 3. Wire bonding 4. Potting 5. Milling (depending on product) The range of products and types of Micromodule are summarized in Table 1 and Table 2. For large volumes, ST is able to offer customized module tape. DELIVERY The Super 35mm metallized epoxy tape is delivered on reels, as shown in Figure 1. These contain all of the chips from a number of wafers, including those chips that were found to be non- functioning during testing. Traceability is ensured by a label fixed on the reel. The typical quantity is 10,000 modules per reel, with priority given to lot integrity on the reel. The maximum quantity is 15,000 per reel. Parts which are faulty (mechanically or electrically defective) are identified by punch holes. The specification for the reject punch holes is shown in Figure 4 for the D10 micromodule, in Figure 5 for the D15 micromodule, in Figure 6 for the D20 micromodule, and in Figure 7 for the D22 micromodule. Tape joins (tape splicing) are never more than 10 per 10 metre length, as shown in Figure 2 and Figure 3. At least 2.1 m of leader, and 2.1 m of trailer is included on each reel. Each is made of PVC Super 35 mm tape, without metalisation, and is opaque to infrared and white light. A “failure” marking of reject holes is included at the beginning and end of the tape of a minimum of 5 consecutive module pitches (double positions). Modules should be stored within the temperature range -40 °Cto + 85 °C, for no more than 1 year. Each reel is packed in an antistatic bag, along with a desiccant bag, and a humidity indicator card. This card indicates the level of humidity as follows: 30 - Blue: protection assured 40 - Pink: renew the desiccant bag 50 - Pink: protection no longer ensured Three self adhesive plastic identification labels are attached: one to the reel, one to the antistatic bag, Table 2. Memory Card Products Type Description (please see the indiv idual product data sheets for full specifications) Process Technology Module Style ST14C02C Memory Card IC, 2 Kbit (256 x 8) Serial I2C Bus EEPROM 1.2 µm CMOS D15, D20 M14C04 Memory Card IC, 4 Kbit Serial I2C Bus EEPROM 0.6 µm CMOS D20 M14C16 Memory Card IC, 16 Kbit Serial I2C Bus EEPROM 0.6 µm CMOS D20 M14C32 Memory Card IC, 32 Kbit Serial I2C Bus EEPROM 0.6 µm CMOS D20 M14C64 Memory Card IC, 64 Kbit Serial I2C Bus EEPROM 0.6 µm CMOS D22 M14128 Memory Card IC, 128 Kbit Serial I2C Bus EEPROM 0.6 µm CMOS D22 M14256 Memory Card IC, 256 Kbit Serial I2C Bus EEPROM 0.6 µm CMOS D22 ST1200 Memory Card IC, 256 bit OTP EPROM with Lock-Out 3.5 µm NMOS D10 ST1305B Memory Card IC, 192 bit High Endurance EEPROM with Secure Logic Access Control 1.5 µm CMOS D10, D15 ST1331 Memory Card IC, 272 bit High Endurance EEPROM with Advanced Security Mechanisms 1.2 µm CMOS D10 ST1333 1.2 µm CMOS D10 ST1335 1.2 µm CMOS D10, D15 ST1336 1.2 µm CMOS D10, D15 M35101 Contactless Memory Chip, 13.56 MHz, 2048 bit EEPROM 0.6 µm CMOS C20, C30 M35102 Contactless Memory Chip with 64-bit Unique ID, 13.56 MHz, 2048 bit EEPROM 0.6 µm CMOS C20, C30 |
同様の部品番号 - ST14C02C |
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同様の説明 - ST14C02C |
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