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OP291GSZ-REEL データシート(PDF) 7 Page - Analog Devices |
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OP291GSZ-REEL データシート(HTML) 7 Page - Analog Devices |
7 / 24 page OP191/OP291/OP491 Rev. D | Page 7 of 24 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Rating Supply Voltage 16 V Input Voltage GND to VS 10 V Differential Input Voltage 7 V Output Short-Circuit Duration to GND Indefinite Storage Temperature Range N, R, RU Packages –65°C to +150°C Operating Temperature Range OP191G/OP291G/OP491G –40°C to +125°C Junction Temperature Range N, R, RU Packages –65°C to +150°C Lead Temperature (Soldering, 60 sec) 300°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply to both DICE and packaged parts, unless otherwise noted. THERMAL RESISTANCE θJA is specified for the worst-case conditions; that is, θJA is specified for device in socket for PDIP packages; θJA is specified for device soldered in circuit board for TSSOP and SOIC packages. Table 5. Thermal Resistance Package Type θJA θJC Unit 8-Lead SOIC (R) 158 43 °C/W 14-Lead PDIP (N) 76 33 °C/W 14-Lead SOIC (R) 120 36 °C/W 14-Lead TSSOP (RU) 180 35 °C/W ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. |
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同様の説明 - OP291GSZ-REEL |
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