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ADCS9888CVH-205 データシート(PDF) 10 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
部品番号 ADCS9888CVH-205
部品情報  205/170/140 MSPS Video Analog Front End
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メーカー  NSC [National Semiconductor (TI)]
ホームページ  http://www.national.com
Logo NSC - National Semiconductor (TI)

ADCS9888CVH-205 データシート(HTML) 10 Page - National Semiconductor (TI)

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DC and Logic Electrical Characteristics (Continued)
The following specifications apply for GND=0V,V
D =VDD =PVD = +3.3 VDC, ADC Clock = 205 MHz, unless otherwise speci-
fied. Boldface limits apply for T
A =TMIN to TMAX; all other limits TA = 25˚C.
Symbol
Parameter
Conditions
Min
(Note 9)
Typical
(Note 8)
Max
(Note 9)
Units
I
DD
I/O Supply Current
25˚C - 140 MSPS
38
mA
25˚C - 170 MSPS
40
25˚C - 205 MSPS
57
IP
VD
PLL Supply Current
25˚C - 140 MSPS
13
mA
25˚C - 170 MSPS
14
25˚C - 205 MSPS
18
Total Power Dissipation
Full Temp. – 140 MSPS
320
365
mA
Full Temp. – 170 MSPS
330
375
Full Temp. – 205 MSPS
390
420
Power Down Supply Current
Full Temp.
8.4
15
mA
Power Down Dissipation
Full Temp.
28
50
mW
Analog Channel Characteristics
The following specifications apply for GND=0V,V
D =VDD =PVD = +3.3 VDC,VDD = +3.3 VDC, ADC Clock = 205 MHz, un-
less otherwise specified. Boldface limits apply for T
A =TMIN to TMAX; all other limits TA = 25˚C (Note 7).
Symbol
Parameter
Conditions
Min
(Note 9)
Typical
(Note 8)
Max
(Note 9)
Units
Analog Bandwidth, Full Power
25˚C
500
MHz
Transient Response
25˚C
2
ns
Overvoltage Recovery Time
25˚C
1.5
ns
SNR
Signal to Noise Ratio
(Without Harmonics)
25˚C – 140 MSPS
40.7
44
dB
25˚C –170 MSPS
40.7
43.5
25˚C –205 MSPS
40.5
43.5
SNR
Signal to Noise Ratio
(Without Harmonics)
Full temp. – 140 MSPS
44
dB
Full Temp. – 170 MSPS
43.5
Full Temp. – 205 MSPS
43.5
Crosstalk
Full Temp.
50
dBc
THERMAL CHARACTERISTICS
θ
JC
Junction to Case Thermal
Resistance
12.3
˚C/W
θ
JA
Junction to Ambient Thermal
Resistance
30.2
˚C/W
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: All voltages are measured with respect to GND=0V, unless otherwise specified.
Note 3: When the input voltage (VIN) at any pin exceeds the power supplies (VIN < GND or VIN > VA or VD), the current at that pin should be limited to 25 mA.
The 50 mA maximum package input current rating limits the number of pins that can simultaneously safely exceed the power supplies with an input current of 25
mA to two.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA and the ambient temperature, TA. The maximum
allowable power dissipation at any temperature is PD =(TJMAX –TA)/θJA.TJMAX = 150˚C for this device. The typical thermal resistance (θJA) of this part when board
mounted is TBD ˚C/W for the VLA128A 128 pin PQFP package.
Note 5: Human body model is 100 pF capacitor discharged through a 1.5 k
Ω resistor. Machine model is 200 pF discharged through a 0 Ω resistor.
Note 6: Soldering process must comply with National Semiconductor’s reflow temperature profile specifications. Refer to "www.national.com/packaging".
Note 7: Two diodes clamp the OS analog inputs to AGND and VA as shown below. This input protection, in combination with the external clamp capacitor and the
output impedance of the video source, prevents damage to the ADCS9888 from transients during power-up.
www.national.com
10


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