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ADCS9888CVH-205 データシート(PDF) 10 Page - National Semiconductor (TI) |
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ADCS9888CVH-205 データシート(HTML) 10 Page - National Semiconductor (TI) |
10 / 34 page DC and Logic Electrical Characteristics (Continued) The following specifications apply for GND=0V,V D =VDD =PVD = +3.3 VDC, ADC Clock = 205 MHz, unless otherwise speci- fied. Boldface limits apply for T A =TMIN to TMAX; all other limits TA = 25˚C. Symbol Parameter Conditions Min (Note 9) Typical (Note 8) Max (Note 9) Units I DD I/O Supply Current 25˚C - 140 MSPS 38 mA 25˚C - 170 MSPS 40 25˚C - 205 MSPS 57 IP VD PLL Supply Current 25˚C - 140 MSPS 13 mA 25˚C - 170 MSPS 14 25˚C - 205 MSPS 18 Total Power Dissipation Full Temp. – 140 MSPS 320 365 mA Full Temp. – 170 MSPS 330 375 Full Temp. – 205 MSPS 390 420 Power Down Supply Current Full Temp. 8.4 15 mA Power Down Dissipation Full Temp. 28 50 mW Analog Channel Characteristics The following specifications apply for GND=0V,V D =VDD =PVD = +3.3 VDC,VDD = +3.3 VDC, ADC Clock = 205 MHz, un- less otherwise specified. Boldface limits apply for T A =TMIN to TMAX; all other limits TA = 25˚C (Note 7). Symbol Parameter Conditions Min (Note 9) Typical (Note 8) Max (Note 9) Units Analog Bandwidth, Full Power 25˚C 500 MHz Transient Response 25˚C 2 ns Overvoltage Recovery Time 25˚C 1.5 ns SNR Signal to Noise Ratio (Without Harmonics) 25˚C – 140 MSPS 40.7 44 dB 25˚C –170 MSPS 40.7 43.5 25˚C –205 MSPS 40.5 43.5 SNR Signal to Noise Ratio (Without Harmonics) Full temp. – 140 MSPS 44 dB Full Temp. – 170 MSPS 43.5 Full Temp. – 205 MSPS 43.5 Crosstalk Full Temp. 50 dBc THERMAL CHARACTERISTICS θ JC Junction to Case Thermal Resistance 12.3 ˚C/W θ JA Junction to Ambient Thermal Resistance 30.2 ˚C/W Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Note 2: All voltages are measured with respect to GND=0V, unless otherwise specified. Note 3: When the input voltage (VIN) at any pin exceeds the power supplies (VIN < GND or VIN > VA or VD), the current at that pin should be limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can simultaneously safely exceed the power supplies with an input current of 25 mA to two. Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA and the ambient temperature, TA. The maximum allowable power dissipation at any temperature is PD =(TJMAX –TA)/θJA.TJMAX = 150˚C for this device. The typical thermal resistance (θJA) of this part when board mounted is TBD ˚C/W for the VLA128A 128 pin PQFP package. Note 5: Human body model is 100 pF capacitor discharged through a 1.5 k Ω resistor. Machine model is 200 pF discharged through a 0 Ω resistor. Note 6: Soldering process must comply with National Semiconductor’s reflow temperature profile specifications. Refer to "www.national.com/packaging". Note 7: Two diodes clamp the OS analog inputs to AGND and VA as shown below. This input protection, in combination with the external clamp capacitor and the output impedance of the video source, prevents damage to the ADCS9888 from transients during power-up. www.national.com 10 |
同様の部品番号 - ADCS9888CVH-205 |
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同様の説明 - ADCS9888CVH-205 |
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