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M27C1001-35B1X データシート(PDF) 6 Page - STMicroelectronics

部品番号 M27C1001-35B1X
部品情報  1 Mbit 128Kb x8 UV EPROM and OTP EPROM
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メーカー  STMICROELECTRONICS [STMicroelectronics]
ホームページ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M27C1001-35B1X データシート(HTML) 6 Page - STMicroelectronics

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M27C1001
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Figure 5. Read Mode AC Waveforms
AI00713B
tAXQX
tEHQZ
A0-A16
E
G
Q0-Q7
tAVQV
tGHQZ
tGLQV
tELQV
VALID
Hi-Z
VALID
Table 8B. Read Mode AC Characteristics (1)
(TA = 0 to 70°C, –40 to 85°C or –40 to 125°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC)
Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. Sampled only, not 100% tested.
Symbol
Alt
Parameter
Test Condition
M27C1001
Unit
-80
-90
-10
-12/-15/
-20/-25
Min
Max
Min
Max
Min
Max
Min
Max
tAVQV
tACC
Address Valid to
Output Valid
E = VIL, G = VIL
80
90
100
120
ns
tELQV
tCE
Chip Enable Low to
Output Valid
G = VIL
80
90
100
120
ns
tGLQV
tOE
Output Enable Low
to Output Valid
E = VIL
40
45
50
60
ns
tEHQZ
(2)
tDF
Chip Enable High to
Output Hi-Z
G = VIL
030030
0
30
0
40
ns
tGHQZ
(2)
tDF
Output Enable High
to Output Hi-Z
E = VIL
030030
0
30
0
40
ns
tAXQX
tOH
Address Transition
to Output Transition
E = VIL, G = VIL
00
00
ns
System Considerations
The power switching characteristics of Advanced
CMOS EPROMs require careful decoupling of the
devices. The supply current, ICC, has three seg-
ments that are of interest to the system designer:
the standby current level, the active current level,
and transient current peaks that are produced by
the falling and rising edges of E. The magnitude of
the transient current peaks is dependent on the
capacitive and inductive loading of the device at
the output. The associated transient voltage peaks
can be suppressed by complying with the two line
output control and by properly selected decoupling
capacitors. It is recommended that a 0.1µF ceram-
ic capacitor be used on every device between VCC
and VSS. This should be a high frequency capaci-
tor of low inherent inductance and should be
placed as close to the device as possible. In addi-
tion, a 4.7µF bulk electrolytic capacitor should be
used between VCC and VSS for every eight devic-
es. The bulk capacitor should be located near the
power supply connection point. The purpose of the
bulk capacitor is to overcome the voltage drop
caused by the inductive effects of PCB traces.


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