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MC33975EK データシート(PDF) 6 Page - Freescale Semiconductor, Inc |
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MC33975EK データシート(HTML) 6 Page - Freescale Semiconductor, Inc |
6 / 34 page Analog Integrated Circuit Device Data 6 Freescale Semiconductor 33975 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Thermal Resistance Junction to Ambient Between the die and the exposed die pad(4) RθJA RθJC 71 1.2 °C/W Peak Package Reflow Temperature During Reflow(5), (6) TPPRT Note 6 °C Notes 5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 6. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. Table 3. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these limits may cause malfunction or permanent damage to the device. Rating Symbol Value Unit ELECTRICAL RATINGS |
同様の部品番号 - MC33975EK |
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同様の説明 - MC33975EK |
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