Analog Integrated Circuit Device Data

Freescale Semiconductor

17

15XS3400

ELECTRICAL CHARACTERISTICS

DYNAMIC ELECTRICAL CHARACTERISTICS

SPI INTERFACE CHARACTERISTICS(34)

Maximum Frequency of SPI Operation

–

–

8.0

MHz

Required Low State Duration for RST(35)

10

–

–

μs

Rising Edge of CS to Falling Edge of CS (Required Setup Time)(36)

–

–

1.0

μs

Rising Edge of RST to Falling Edge of CS (Required Setup Time)(36)

–

–

5.0

μs

Falling Edge of CS to Rising Edge of SCLK (Required Setup Time)(36)

–

–

500

ns

Required High State Duration of SCLK (Required Setup Time)(36)

–

–

50

ns

Required Low State Duration of SCLK (Required Setup Time)(36)

–

–

50

ns

Falling Edge of SCLK to Rising Edge of CS (Required Setup Time)(36)

–

–

60

ns

SI to Falling Edge of SCLK (Required Setup Time)(37)

–

–

37

ns

Falling Edge of SCLK to SI (Required Setup Time)(37)

–

–

49

ns

SO Rise Time

–

–

13

ns

SO Fall Time

–

–

13

ns

SI, CS, SCLK, Incoming Signal Rise Time(37)

–

–

13

ns

SI, CS, SCLK, Incoming Signal Fall Time(37)

–

–

13

ns

Time from Rising Edge of SCLK to SO Low-impedance(38)

–

–

60

ns

Time from Rising Edge of SCLK to SO High-impedance(39)

–

–

60

ns

Notes

34.

Parameters guaranteed by design.

35.

RST

low duration measured with outputs enabled and going to OFF or disabled condition.

36.

Maximum setup time required for the 15XS3400 is the minimum guaranteed time needed from the microcontroller.

37.

Rise and Fall time of incoming SI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing.

38.

Time required for output status data to be available for use at SO. 1.0k

Ω on pull-up on CS.

39.

Time required for output status data to be terminated at SO. 1.0k

Ω on pull-up on CS.

Table 4. Dynamic Electrical Characteristics (continued)

Characteristics noted under conditions 6.0V

otherwise noted.

Characteristic

Symbol

Min

Typ

Max

Unit