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MC34676 データシート(PDF) 4 Page - Freescale Semiconductor, Inc |
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MC34676 データシート(HTML) 4 Page - Freescale Semiconductor, Inc |
4 / 27 page Analog Integrated Circuit Device Data 4 Freescale Semiconductor 34676 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit ELECTRICAL RATINGS Input Supply Voltage Pins VAC, VUSB -0.3 to 28 V Charge State Indication Pins VPPR, VCHG -0.3 to 12 V BAT, BATDET, USBEN, USBOUT, ISET, IUSB, IMIN Pins VBAT, VBATDET, VUSBEN, VUSBOUT, VISET, VIUSB, VIMIN -0.3 to 5.5 V ESD Voltage(1) Human Body Model (HBM) Machine Model (MM) VESD ±2000 ±200 V THERMAL RATINGS Operating Ambient Temperature Range TA -40 to +85 °C Storage Temperature Range TSTG -65 to +150 °C Peak Package Reflow Temperature During Reflow(2), (3) TPPRT Note 3 °C Maximum Junction Temperature TJ +150 °C Thermal Resistance(4) Junction-to-Case Junction-to-Ambient RθJC RθJA 24 90 °C/W Notes 1. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω), and the Machine Model (MM) (CZAP = 200 pF, RZAP = 0 Ω). 2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 3. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL). Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. 4. Device mounted on the Freescale EVB test board per JEDEC DESD51-2. |
同様の部品番号 - MC34676 |
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同様の説明 - MC34676 |
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