データシートサーチシステム |
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OP07DD データシート(PDF) 2 Page - Texas Instruments |
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OP07DD データシート(HTML) 2 Page - Texas Instruments |
2 / 7 page OP07C, OP07D, OP07Y PRECISION OPERATIONAL AMPLIFIERS SLOS099B – OCTOBER 1983 – REVISED AUGUST 1996 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 OP07Y chip information These chips, properly assembled, display characteristics similar to the OP07. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ± 10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. OUT VCC – VCC+ OFFSET N2 IN – IN + OFFSET N1 (4) (6) (7) (8) (2) (3) (1) + – BONDING PAD ASSIGNMENTS 94 72 (4) (6) (7) (8) (2) (3) (1) |
同様の部品番号 - OP07DD |
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同様の説明 - OP07DD |
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