データシートサーチシステム |
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FM23MLD16-60-BG データシート(PDF) 6 Page - Ramtron International Corporation |
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FM23MLD16-60-BG データシート(HTML) 6 Page - Ramtron International Corporation |
6 / 13 page FM23MLD16 - 512Kx16 FRAM (multi die) Rev. 1.0 Dec. 2008 Page 6 of 13 PCB Layout Recommendations A 0.1uF decoupling capacitor should be placed close to each power/ground pair (solder balls 1D/1E and 6D/6E). The ground side of the capacitor should be connected to either a ground plane or low impedance path back to the VSS pins. It is best to use a chip capacitor that has low ESR and has good high frequency characteristics. If the controller drives the address and chip enable from the same timing edge, it is best to keep the address routes short and of equal length. A simple RC circuit may be inserted in the chip enable path to provide some delay and timing margin for the FM23MLD16’s address setup time tAS. As a general rule, the layout designer may need to add series termination resistors to controller outputs that have fast transitions or routes that are > 15cm in length. This is only necessary if the edge rate is less than or equal to the round trip trace delay. Signal overshoot and ringback may be large enough to cause erratic device behavior. It is best to add a 50 ohm resistor (30 – 60 ohms) near the output driver (controller) to reduce such transmission line effects. |
同様の部品番号 - FM23MLD16-60-BG |
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同様の説明 - FM23MLD16-60-BG |
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