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LA16B-Y-6 データシート(PDF) 5 Page - LIGITEK electronics co., ltd. |
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LA16B-Y-6 データシート(HTML) 5 Page - LIGITEK electronics co., ltd. |
5 / 5 page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 JIS C 7021: B-12 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Solderability Test This test intended to see soldering well performed or not. The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. High Temperature High Humidity Test Solder Resistance Test Thermal Shock Test Low Temperature Storage Test The purpose of this test is the resistance of the device under tropical for hous. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Reliability Test: Operating Life Test Test Item PART NO. LA16B/Y-6 This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Test Condition Description Reference Standard Page 4/4 |
同様の部品番号 - LA16B-Y-6 |
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同様の説明 - LA16B-Y-6 |
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