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LA112B-SEFVY.VG-PF データシート(PDF) 7 Page - LIGITEK electronics co., ltd. |
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LA112B-SEFVY.VG-PF データシート(HTML) 7 Page - LIGITEK electronics co., ltd. |
7 / 8 page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/7 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 260 °C3sec Max 260° Temp( °C) Dip Soldering Preheat: 120 °C Max Preheat time: 60seconds Max Ramp-up 2 °C/sec(max) Ramp-Down:-5 °C/sec(max) Solder Bath:260 °C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile 5 °/sec max Time(sec) 150 100 Preheat 50 2 °/sec max 120° 0° 0 25° Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 60 Seconds Max PART NO. LA112B/SEFVY.VG-PF |
同様の部品番号 - LA112B-SEFVY.VG-PF |
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同様の説明 - LA112B-SEFVY.VG-PF |
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