データシートサーチシステム |
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LA174B-G.YG-PF データシート(PDF) 6 Page - LIGITEK electronics co., ltd. |
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LA174B-G.YG-PF データシート(HTML) 6 Page - LIGITEK electronics co., ltd. |
6 / 7 page Dip Soldering Preheat: 120° C Max Preheat time: 120seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 100 0 0° Preheat 25° 120° 2° /sec max 250 200 Time(sec) 260° Temp(° C) 5° /sec max 260° C3sec Max Page 5/6 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 120 Seconds Max PART NO. LA174B/G.YG-PF |
同様の部品番号 - LA174B-G.YG-PF |
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同様の説明 - LA174B-G.YG-PF |
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