2/4

Format #: COTCO-D-074

REV.4

Document No.

SPE/LD-300CBL2-C5-MT

Rev. No.

04

F

s

P

e

-

High luminous flux output for illumination

-

Exposed pad design for excellent heat transfer

-

Designed for high current operation

-

Reflow soldering applicable

A

5

Items

Symbol Absolute maximum Rating Unit

Forward Current

100

mA

Peak Forward Current**

150

mA

Reverse Voltage

5

V

Power Dissipation

0.48

W

Operation Temperature

-40 ~ +85

°C

Storage Temperature

-40 ~ +85

°C

Junction Temperature

+110

°C

Junction-to- Ambient***

θ

ja

135

Junction-to-Case***

θ

jc

70

A : ANODE

B : HEAT SINK

C : CATHODE

BACK VIEW

SIDE VIEW

TOP VIEW

ALL DIMENSION IS IN mm

A

B

C

*Metal core PCB defines as good heat transmission substrate (thickness of 1.7mm Al-based PCB in 12x12mm,

** Where pulse width <= 0.1msec, duty cycle <= 1/10

*** Rth test condition: mounted on 1.7mm Al-based PCB in size of 12x12mm

T

5

Items

Symbol

Condition

Min.

Typ.

Max.

Unit

Forward Voltage

4.0

4.8

V

Reverse Current

---

---

10

µA

Luminous Flux

lumen

1

2.3

---

lm

Dominant Wavelength

λ

D

460

470

476

nm

2

θ½ H-H

---

125

---

deg

50% Power Angle

2

θ½ V-V

---

115

---

deg