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ADMP404ACEZ データシート(PDF) 8 Page - Analog Devices |
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ADMP404ACEZ データシート(HTML) 8 Page - Analog Devices |
8 / 12 page ADMP404 Preliminary Technical Data Rev. PrH | Page 8 of 12 PCB LAND PATTERN LAYOUT The recommended PCB land pattern for the ADMP404 should be laid out to a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 9. Care should be taken to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil pattern layout is shown in Figure 10. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. Ø1.55 Ø0.95 1.52 0.90 1.90 1.22 0.68 0.61 0.61 Figure 9. PCB Land Pattern Layout 1.22 2× 0.8 × 0.6 0.2 × 45 TYP 1.52mm 1.55/1.05 DIA. 0.225 CUT WIDTH (2×) Figure 10. Suggested Solder Paste Stencil Pattern Layout |
同様の部品番号 - ADMP404ACEZ |
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同様の説明 - ADMP404ACEZ |
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