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ADP886XMB1-EVALZ データシート(PDF) 5 Page - Analog Devices

部品番号 ADP886XMB1-EVALZ
部品情報  Charge Pump, 7-Channel Smart LED Driver with I2C Interface
Download  40 Pages
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メーカー  AD [Analog Devices]
ホームページ  http://www.analog.com
Logo AD - Analog Devices

ADP886XMB1-EVALZ データシート(HTML) 5 Page - Analog Devices

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ADP8861
Rev. 0 | Page 5 of 40
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
VIN, VOUT
−0.3 V to +6 V
D1, D2, D3, D4, D5, D6, and D7
−0.3 V to +6 V
nINT, nRST, SCL, and SDA
−0.3 V to +6 V
Output Short-Circuit Duration
Indefinite
Operating Temperature Range
Ambient (TA)
–40°C to +85°C1
Junction (TJ)
–40°C to +125°C
Storage Temperature Range
–65°C to +150°C
Soldering Conditions
JEDEC J-STD-020
ESD (Electrostatic Discharge)
Human Body Model (HBM)
±3 kV
Charged Device Model (CDM)
±1.5 kV
1 The maximum operating junction temperature (TJ(MAX)) takes precedence
over the maximum operating ambient temperature (TA(MAX)). See the
Maximum Temperature Ranges section for more information.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all voltages are
referenced to ground.
MAXIMUM TEMPERATURE RANGES
The maximum operating junction temperature (TJ(MAX)) takes
precedence over the maximum operating ambient temperature
(TA(MAX)). Therefore, in situations where the ADP8861 is
exposed to poor thermal resistance and high power dissipation
(PD), the maximum ambient temperature may need to be
derated. In these cases, the maximum ambient temperature can
be calculated with the following equation:
TA(MAX) = TJ(MAX) − (θJA × PD(MAX))
THERMAL RESISTANCE
θJA (junction to air) is specified for the worst-case conditions,
that is, a device soldered in a circuit board for surface-mount
packages. The θJA and θJC (junction to case) are determined
according to JESD51-9 on a 4-layer printed circuit board (PCB)
with natural convection cooling. For the LFCSP package, the
exposed pad must be soldered to the GND1 and/or GND2
terminal on the board.
Table 3. Thermal Resistance
Package Type
θJA
θJC
Unit
20-Lead LFCSP_WQ
49.5
5.3
°C/W
ESD CAUTION


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