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9000 データシート(PDF) 3 Page - Intel Corporation |
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9000 データシート(HTML) 3 Page - Intel Corporation |
3 / 108 page Dual-Core Intel® Itanium® Processor 9000 and 9100 Series Datasheet 3 Contents 1 Introduction............................................................................................................... 11 1.1 Overview ......................................................................................................... 11 1.2 Processor Abstraction Layer ................................................................................ 11 1.3 Mixing Processors of Different Frequencies and Cache Sizes .................................... 12 1.4 Terminology ..................................................................................................... 12 1.5 State of Data .................................................................................................... 12 1.6 Reference Documents ........................................................................................ 13 2 Electrical Specifications ............................................................................................... 15 2.1 Dual-Core Intel® Itanium® Processor 9000 and 9100 Series System Bus .................. 15 2.1.1 System Bus Power Pins ........................................................................ 15 2.1.2 System Bus No Connect ....................................................................... 15 2.2 System Bus Signals ........................................................................................... 15 2.2.1 Signal Groups ..................................................................................... 15 2.2.2 Signal Descriptions .............................................................................. 17 2.3 Package Specifications ....................................................................................... 18 2.4 Signal Specifications .......................................................................................... 18 2.4.1 Maximum Ratings ................................................................................ 22 2.5 System Bus Signal Quality Specifications and Measurement Guidelines ..................... 23 2.5.1 Overshoot/Undershoot Magnitude .......................................................... 23 2.5.2 Overshoot/Undershoot Pulse Duration .................................................... 24 2.5.3 Activity Factor..................................................................................... 24 2.5.4 Reading Overshoot/Undershoot Specification Tables ................................. 24 2.5.5 Determining if a System Meets the Overshoot/Undershoot Specifications...................................................................................... 25 2.5.6 Wired-OR Signals ................................................................................ 25 2.6 Voltage Regulator Connector Signals.................................................................... 27 2.7 System Bus Clock and Processor Clocking............................................................. 31 2.8 Recommended Connections for Unused Pins.......................................................... 33 3 Pinout Specifications ................................................................................................... 35 4 Mechanical Specifications............................................................................................. 65 4.1 Processor Package Dimensions............................................................................ 65 4.1.1 Voltage Regulator (MVR) to Processor Package Interface........................... 71 4.2 Package Marking ............................................................................................... 72 4.2.1 Processor Top-Side Marking .................................................................. 72 4.2.2 Processor Bottom-Side Marking ............................................................. 73 5 Thermal Specifications ................................................................................................ 75 5.1 Thermal Features .............................................................................................. 75 5.1.1 Thermal Alert...................................................................................... 75 5.1.2 Enhanced Thermal Management ............................................................ 76 5.1.3 Power Trip .......................................................................................... 76 5.1.4 Thermal Trip ....................................................................................... 76 5.2 Case Temperature ............................................................................................. 76 6 System Management Feature Specifications ................................................................... 79 6.1 System Management Bus ................................................................................... 79 6.1.1 System Management Bus Interface ........................................................ 79 6.1.2 System Management Interface Signals ................................................... 79 6.1.3 SMBus Device Addressing ..................................................................... 81 6.2 Processor Information ROM ................................................................................ 82 6.3 Scratch EEPROM ............................................................................................... 85 |
同様の部品番号 - 9000 |
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同様の説明 - 9000 |
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