ISL28118, ISL28218

3

FN7532.3

September 21, 2011

Ordering Information

PART NUMBER

(Notes 2, 3)

PART MARKING

TEMPERATURE RANGE

(°C)

PACKAGE

(Pb-Free)

PKG.

DWG. #

ISL28118FBZ (Note 1)

28118 FBZ

-40 to +125

8 Ld SOIC

M8.15E

Coming Soon

ISL28118FRTZ (Note 1)

118Z

-40 to +125

8 Ld TDFN

L8.3x3A

ISL28118FUZ (Note 1)

8118Z

-40 to +125

8 Ld MSOP

M8.118

ISL28218FBZ (Note 1)

28218 FBZ

-40 to +125

8 Ld SOIC

M8.15E

Coming Soon

ISL28218FRTZ

218Z

-40 to +125

8 Ld TDFN

L8.3x3A

Coming Soon

ISL28218FUZ

8218Z

-40 to +125

8 Ld MSOP

M8.118

ISL28218SOICEVAL1Z

Evaluation Board

NOTES:

1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.

2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte

tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil

Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

3. For Moisture Sensitivity Level (MSL), please see device information pages for ISL28118, ISL28218. For more information on MSL, please see

Technical Brief TB363.