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7447797620 データシート(PDF) 6 Page - Analog Devices |
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7447797620 データシート(HTML) 6 Page - Analog Devices |
6 / 32 page ADP2325 Data Sheet Rev. 0 | Page 6 of 32 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating PVIN1, PVIN2, EN1, EN2 −0.3 V to +22 V SW1, SW2 −1 V to +22 V BST1, BST2 VSW + 6 V FB1, FB2, SS1, SS2, COMP1, COMP2, PGOOD1, PGOOD2, TRK1, TRK2, SCFG, SYNC, RT, MODE −0.3 V to +6 V INTVCC, VDRV, DL1, DL2 −0.3 V to +6 V PGND to GND −0.3 V to +0.3 V Temperature Range Operating (Junction) −40°C to +125°C Storage −65°C to +150°C Soldering Conditions JEDEC J-STD-020 THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Boundary Condition θJA is measured using natural convection on a JEDEC 4-layer board, and the exposed pad is soldered to the printed circuit board (PCB) with thermal vias. Table 3. Thermal Resistance Package Type θJA Unit 32-Lead LFCSP_WQ 32.7 °C/W ESD CAUTION Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. |
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同様の説明 - 7447797620 |
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