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MC10XS3412DHFK データシート(PDF) 2 Page - Freescale Semiconductor, Inc |
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MC10XS3412DHFK データシート(HTML) 2 Page - Freescale Semiconductor, Inc |
2 / 51 page Analog Integrated Circuit Device Data 2 Freescale Semiconductor 10XS3412 DEVICE VARIATIONS DEVICE VARIATIONS Table 1. Device Variations Characteristic Symbol Min Typ Max Unit Wake Input Clamp Voltage, ICL(WAKE) < 2.5 mA 10XS3412CHFK 10XS3412DHFK VCL(WAKE) 19 20 25 27 32 35 V Fault Detection Blanking Time 10XS3412CHFK 10XS3412DHFK tFAULT - - 5.0 5.0 20 10 μs Output Shutdown Delay Time 10XS3412CHFK 10XS3412DHFK tDETECT - - 7.0 7.0 30 20 μs Peak Package Reflow Temperature During Reflow(1), (2) TPPRT Note 2 °C Notes 1. Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 2. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics. |
同様の部品番号 - MC10XS3412DHFK |
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同様の説明 - MC10XS3412DHFK |
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