SN74AHC74Q-Q1 datasheet(3/11 Pages) TI1

部品番号	SN74AHC74Q-Q1

部品情報	DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET

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SN74AHC74QQ1

DUAL POSITIVEEDGETRIGGERED DTYPE FLIPFLOP

WITH CLEAR AND PRESET

SGDS020A − FEBRUARY 2002 − REVISED APRIL 2008

3

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†

Supply voltage range, VCC

−0.5 V to 7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range, VI (see Note 1)

−0.5 V to 7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output voltage range, VO (see Note 1)

−0.5 V to VCC + 0.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input clamp current, IIK (VI < 0)

−20 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output clamp current, IOK (VO < 0 or VO > VCC)

±20 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous output current, IO (VO = 0 to VCC)

±25 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous current through VCC or GND

±50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance,

θJA (see Note 2): D package

86

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PW package

113

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, Tstg

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. The package thermal impedance is calculated in accordance with JESD 51-7.

recommended operating conditions (see Note 3)

MIN

MAX

UNIT

VCC

Supply voltage

2

5.5

V

VCC = 2 V

1.5

VIH

High-level input voltage

VCC = 3 V

2.1

V

VIH

High-level input voltage

VCC = 5.5 V

3.85

V

VCC = 2 V

0.5

VIL

Low-level input voltage

VCC = 3 V

0.9

V

VIL

Low-level input voltage

VCC = 5.5 V

1.65

V

VI

Input voltage

0

5.5

V

VO

Output voltage

0

VCC

V

VCC = 2 V

−50

mA

IOH

High-level output current

VCC = 3.3 V ± 0.3 V

−4

mA

IOH

High-level output current

VCC = 5 V ± 0.5 V

−8

mA

VCC = 2 V

50

mA

IOL

Low-level output current

VCC = 3.3 V ± 0.3 V

4

mA

IOL

Low-level output current

VCC = 5 V ± 0.5 V

8

mA

∆t/∆v

Input transition rise or fall rate

VCC = 3.3 V ± 0.3 V

100

ns/V

∆t/∆v

Input transition rise or fall rate

VCC = 5 V ± 0.5 V

20

ns/V

TA

Operating free-air temperature

−40

125

°C

NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

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