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STEVAL-TDR009V1 データシート(PDF) 9 Page - STMicroelectronics |
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STEVAL-TDR009V1 データシート(HTML) 9 Page - STMicroelectronics |
9 / 13 page STEVAL-TDR009V1 SD2932 mounting recommendations Doc ID 17347 Rev 1 9/13 6 SD2932 mounting recommendations 6.1 Mounting recommendations ● Ensure holes in heatsinks are free from burrs; ● Minimum depth of tapped holes in heatsinks is 6 mm; ● Use 4-40 UNC-2A cheese-head screws with a flat washer to spread the joint pressure; ● The minimum flatness of the mounting area is 0.02 mm; ● Mounting area roughness should be less than 0.5 µm (micro); ● Avoid, as much as possible, use of flux or flux solutions because flux can penetrate even when hermetically sealed ceramic-capped transistors. Tin and wash the printed- circuit board BEFORE mounting the power transistors, then solder the transistor leads without using flux; ● Transistor leads may be tinned by dipping them full-length into a solder bath at a temperature of about 230 °C. No flux should be used during tinning; ● Recommended heatsink compounds: WPSII (silicon free) from Austerlitz Electronics, 340 from dow corning etc. 6.2 Mounting sequence ● Apply a thin layer of evenly distributed heatsink compound to the flange; ● Position the device with flat washers in place; ● Tighten the screws until finger tight (0.05 Nm); ● Further tighten the screws until the specified torque is reached; ● For M174, M177 and M244 type of packages, torque should be minimum 0.6 Nm and 0.75 Nm max. Table 4. DMOS packages - list of materials Package Type Description Flange Leadframe Ceramic insulator Plating Torque (Nm) Leads Flange Min Max M174 0.500 dia 4l non herm w/flange Cu Alloy 42 (Fe58 / Ni42) BeO (99.5% min) Au (100 µ min) over Ni (100 µ min / 350 µ max) Ni(100 µ min) + Pd (10 µ min) 0.6 0.75 M174 (Moly disk) 0.500 dia 4l non herm w/flange (moly disk) Cu-Mo- Cu Alloy 42 (Fe58 / Ni42) BeO (99.5% min) Au (100 µ min) over Ni (100 µ min / 350 µ max) Ni(100 µ min) + Pd (10 µ min) 0.6 0.75 M177 0.550 dia 4l non herm w/flange Cu-Mo- Cu Alloy 42 (Fe58 / Ni42) BeO (99.5% min) Au (60 µ min) over Ni (100 µ min / 350 µ max) Au (100 µ min) over Ni (100 µ min / 350µ max) 0.6 0.75 M244 2 x 0.400x0.425 wide 2l lap n/h flange W (85%) - Cu (15%) Alloy 42 (Fe58 / Ni42) BeO(99.5 % min) Au (60 µ min) over Ni (100 µ min / 350µ max) Au (60 µ min) over Ni (100 µ min / 350µ max) 0.6 0.75 |
同様の部品番号 - STEVAL-TDR009V1 |
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同様の説明 - STEVAL-TDR009V1 |
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