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AD558T データシート(PDF) 3 Page - Analog Devices

部品番号 AD558T
部品情報  DACPORT Low Cost, Complete uP-Compatible 8-Bit DAC
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メーカー  AD [Analog Devices]
ホームページ  http://www.analog.com
Logo AD - Analog Devices

AD558T データシート(HTML) 3 Page - Analog Devices

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AD558
REV. A
–3–
ABSOLUTE MAXIMUM RATINGS*
VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to +18 V
Digital Inputs (Pins 1–10) . . . . . . . . . . . . . . . . . . 0 V to +7.0 V
VOUT . . . . . . . . . . . . . . . . . . . . . . . Indefinite Short to Ground
Momentary Short to VCC
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW
Storage Temperature Range
N/P (Plastic) Packages . . . . . . . . . . . . . . . . –25
°C to +100°C
D (Ceramic) Package . . . . . . . . . . . . . . . . . –55
°C to +150°C
Lead Temperature (soldering, 10 sec) . . . . . . . . . . . . . +300
°C
Thermal Resistance
Junction to Ambient/Junction to Case
D (Ceramic) Package . . . . . . . . . . . . . . 100
°C/W/30°C/W
N/P (Plastic) Packages . . . . . . . . . . . . . 140
°C/W/55°C/W
*Stresses greater than those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
AD558 METALIZATION PHOTOGRAPH
Dimensions shown in inches and (mm).
Figure 1a. AD558 Pin Configuration (DIP)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
AD558
TOP VIEW
(Not to Scale)
VOUT
VOUT SENSE
VOUT SELECT
GND
GND
+VCC
CS
(LSB) DB0
DB1
DB2
DB3
DB4
DB5
DB6
(MSB) DB7
CE
Figure 1a. AD558 Pin Configuration (DIP)
AD558
TOP VIEW
(Not to Scale)
1
2
3
20 19
9 10 11 12 13
4
5
7
6
8
18
17
16
15
14
VOUTSELECT
GND
NC
GND
+VCC
DB2
DB3
DB4
DB5
NC
NC = NO CONNECT
Figure 1b. AD558 Pin Configuration (PLCC and LCC)
ORDERING GUIDE
Relative Accuracy
Full-Scale
Error Max
Error, Max
Package
Model
1
Temperature
TMIN to TMAX
TMIN to TMAX
Option
2
AD558JN
0
°C to +70°C
±1/2 LSB
±2.5 LSB
Plastic (N-16)
AD558JP
0
°C to +70°C
±1/2 LSB
±2.5 LSB
PLCC (P-20A)
AD558JD
0
°C to +70°C
±1/2 LSB
±2.5 LSB
TO-116 (D-16)
AD558KN
0
°C to +70°C
±1/4 LSB
±1 LSB
Plastic (N-16)
AD558KP
0
°C to +70°C
±1/4 LSB
±1 LSB
PLCC (P-20A)
AD558KD
0
°C to +70°C
±1/4 LSB
±1 LSB
TO-116 (D-16)
AD558SD
–55
°C to +125°C
±3/4 LSB
±2.5 LSB
TO-116 (D-16)
AD558TD
–55
°C to +125°C
±3/8 LSB
±1 LSB
TO-116 (D-16)
NOTES
1For details on grade and package offerings screened in accordance with MIL-STD-883, refer to the Analog Devices
Military Products Databook or current AD558/883B data sheet.
2D = Ceramic DIP; N = Plastic DIP; P = Plastic Leaded Chip Carrier.


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