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ST0603XR101B631 データシート(PDF) 9 Page - MERITEK ELECTRONICS CORPORATION |
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ST0603XR101B631 データシート(HTML) 9 Page - MERITEK ELECTRONICS CORPORATION |
9 / 10 page ![]() No. Item Test Condition Requirements 1. Visual and Mechanical --- * No remarkable defect. * Dimensions to conform to individual specification sheet. 2. Capacitance * Shall not exceed the limits given in the detailed spec. 3. Q/ D.F. (Dissipation Factor) Class I: (NP0) Cap≤1000pF, 1.0±0.2Vrms, 1MHz±10% Cap>1000pF, 1.0±0.2Vrms, 1KHz±10% Class II: (X7R) 1.0±0.2Vrms, 1kHz±10% NP0: Cap≥30pF, Q≥1000; Cap<30pF, Q≥400+20C X7R: ≤2.5% 4. Temperature Coefficient With no electrical load. T.C. Operating Temp NP0 -55~125°C at 25°C X7R -55~125°C at 25°C T.C. Capacitance Change NPO Within ±30ppm/°C X7R Within ±15% 5. Insulation Resistance UR=100V: To apply voltage at UR for max. 120 sec. UR>100V: To apply voltage at UR (500V max.) for 60 sec. Class I (NP0) : ≥100G or RxC≥1000 -F whichever is smaller. Class II (X7R) : ≥10G or RxC≥500 -F whichever is smaller. 6. Dielectric Strength * To apply voltage: 100V =2.5 times of UR 200V/250V =2 times of UR 500V =1.5 times of UR > 500V =1.2 times of UR * Duration: 1 to 5 sec. * No evidence of damage or flashover during test. 7. Solderability * Solder temperature: 235±5°C * Dipping time: 2±0.5 sec. NPO:95% min. coverage of all metalized area. X7R:75% min. coverage of all metalized area. 8. Resistance to Soldering Heat * Solder temperature: 260±5°C * Dipping time: 10±1 sec * Preheating: 120 to 150°C for 1 minute before immerse the capacitor in a eutectic solder. * Before initial measurement : Perform 150+0/-10°C for 1 hr and then set for 48±4 hrs at room temp. * Measurement to be made after keeping at room temp. for 24±2hrs (Class I) or 48±4 hrs (Class II) * No remarkable damage. * Cap change: NP0: within ±2.5% or ±0.25pF whichever is larger. * Q/D.F., I.R. and dielectric strength: To meet initial requirements. X7R: within ±15% * 25% max. leaching on each edge. 9. Temperature Cycle * Conduct the five cycles according to the temperatures and time. Step Temp. (°C) Time (min.) 1 Min. operating temp. +0/-3 30±3 2 Room temp. 2~3 3 Max. operating temp. +3/-0 30±3 4 Room temp. 2~3 * Before initial measurement : Perform 150+0/-10°C for 1 hr and then set for 48±4 hrs at room temp. * Measurement to be made after keeping at room temp. for 24±2 hrs. (Class I) or 48±4 hrs (Class II) * No remarkable damage. * Cap change: NP0: within ±2.5% or ±0.25pF whichever is larger. X7R: within ±15% * Q/D.F.: X7R: ≤1.5 × Initial requirement * I.R.≥ 0.25 × initial requirements. 10. Humidity (Damp Heat) Steady State * Test temp.: 40±2°C * Humidity: 90~95% RH * Test time: 500+24/-0hrs. * Measurement to be made after keeping at room temp. for 24±2 hrs. (Class I) or 48±4 hrs (Class II) * No remarkable damage. * Cap change: NP0: within ±5.0% or ±0.5pF whichever is larger. X7R :within ±15% Q/D.F Value: NP0: Cap≥30pF, Q≥350; 10pF≤Cap<30pF, Q≥275+2.5C Cap<10pF; Q≥200+10C X7R: ≤7.0% * I.R.: ≥1G or RxC≥50 -F whichever is smaller. Soft Termination Multilayer Ceramic Chip Capacitors RoHS MERITEK ST Series RELIABILITY TEST CONDITIONS AND REQUIREMENTS Rev.7 |
同様の部品番号 - ST0603XR101B631 |
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同様の説明 - ST0603XR101B631 |
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