TS3DV642A0RUAR datasheet(4/17 Pages) TI1

部品番号	TS3DV642A0RUAR

部品情報	12-Channel 1:2 MUX/DEMUX with1.8V Compatible Control and Power-Down Mode

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TS3DV642

SCDS343 – MAY 2013

www.ti.com

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Supply voltage range

–0.5

5.5

V

VI/O

Analog voltage range(2)(3)(4)

All I/O

–0.5

5.5

V

VIN

Digital input voltage range(2)(3)

SEL1, SEL2,EN

–0.5

5.5

V

II/OK

Analog port diode current

VI/O < 0

–50

mA

IIK

Digital input clamp current

VIN < 0

–50

mA

II/O

On-state switch current(5)

–128

128

mA

θJA

Package thermal impedance(6)

RUA package

TBD

°C/W

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to ground, unless otherwise specified.

(3)

The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

(4)

VI and VO are used to denote specific conditions for VI/O.

(5)

II and IO are used to denote specific conditions for II/O.

(6)

The package thermal impedance is calculated in accordance with JESD 51-7.

RECOMMENDED OPERATING CONDITIONS

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Supply voltage

2.6

4.5

V

VI/O

Input/Output voltage

0

5.5

V

TA

Operating free-air temperature

–40

85

°C

(1)

All unused control inputs of the device must be held at VDD or GND to ensure proper device operation. Refer to the TI application

report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

ELECTRICAL CHARACTERISTICS

PARAMETER

TEST CONDITIONS(1)

MIN TYP(2)

MAX

UNIT

PORT A

D0 to D3

6.5

9.5

Ω

VCC = 3 V, 1.5 V ≤ VI/O ≤ VCC,

RON

ON-state resistance

II/O = –40 mA

SCL, SDA, HPE, CEC

6

9.5

Ω

VCC = 3 V, VI/O = 1.5 V and VCC,

ON-state resistance

RON(flat)

(3)

All I/O

1.5

Ω

flatness

II/O = –40 mA

On-state resistance

VCC = 3 V, 1.5 V

≤ VI/O ≤ VCC,

ΔRON

(4)

match between high-

D0 to D3

0.4

1

Ω

II/O = –40 mA

speed channels

VCC = 0 V, VI/O = 0 to 3.6 V,

IOFF

Leakage under power off All outputs

±10

µA

VIN = 0 V to 5.5 V

PORT B

D0 to D3

8.2

10.5

Ω

VCC = 3 V, 1.5 V ≤ VI/O ≤ VCC,

RON

ON-state resistance

II/O = -40 mA

SCL, SDA, HPE, CEC

6

10.5

Ω

VCC = 3 V, VI/O = 1.5 V and VCC,

ON-state resistance

RON(flat)

(3)

All I/O

1.5

Ω

flatness

II/O = –40 mA

On-state resistance

VCC = 3 V, 1.5 V ≤ VI/O ≤ VCC,

ΔRON

(4)

match between high-

D0 to D3

0.4

1

Ω

II/O = –40 mA

speed channels

VCC = 0 V, VI/O = 0 V to 3.6 V,

IOFF

Leakage under power off All outputs

±10

µA

VIN = V to 5.5 V

(1)

VI, VO, II, and IO refer to I/O pins, VIN refers to the control inputs

(2)

All typical values are at VCC = 3.3V (unless otherwise noted), TA = 25°C

(3)

RON(FLAT) is the difference of RON in a given channel at specified voltages.

(4)

ΔRON is the difference of RON from center port to any other ports.

4

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