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AD558TD データシート(PDF) 3 Page - Analog Devices |
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AD558TD データシート(HTML) 3 Page - Analog Devices |
3 / 8 page AD558 REV. A –3– ABSOLUTE MAXIMUM RATINGS* VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to +18 V Digital Inputs (Pins 1–10) . . . . . . . . . . . . . . . . . . 0 V to +7.0 V VOUT . . . . . . . . . . . . . . . . . . . . . . . Indefinite Short to Ground Momentary Short to VCC Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW Storage Temperature Range N/P (Plastic) Packages . . . . . . . . . . . . . . . . –25 °C to +100°C D (Ceramic) Package . . . . . . . . . . . . . . . . . –55 °C to +150°C Lead Temperature (soldering, 10 sec) . . . . . . . . . . . . . +300 °C Thermal Resistance Junction to Ambient/Junction to Case D (Ceramic) Package . . . . . . . . . . . . . . 100 °C/W/30°C/W N/P (Plastic) Packages . . . . . . . . . . . . . 140 °C/W/55°C/W *Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. AD558 METALIZATION PHOTOGRAPH Dimensions shown in inches and (mm). Figure 1a. AD558 Pin Configuration (DIP) 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 AD558 TOP VIEW (Not to Scale) VOUT VOUT SENSE VOUT SELECT GND GND +VCC CS (LSB) DB0 DB1 DB2 DB3 DB4 DB5 DB6 (MSB) DB7 CE Figure 1a. AD558 Pin Configuration (DIP) AD558 TOP VIEW (Not to Scale) 1 2 3 20 19 9 10 11 12 13 4 5 7 6 8 18 17 16 15 14 VOUTSELECT GND NC GND +VCC DB2 DB3 DB4 DB5 NC NC = NO CONNECT Figure 1b. AD558 Pin Configuration (PLCC and LCC) ORDERING GUIDE Relative Accuracy Full-Scale Error Max Error, Max Package Model 1 Temperature TMIN to TMAX TMIN to TMAX Option 2 AD558JN 0 °C to +70°C ±1/2 LSB ±2.5 LSB Plastic (N-16) AD558JP 0 °C to +70°C ±1/2 LSB ±2.5 LSB PLCC (P-20A) AD558JD 0 °C to +70°C ±1/2 LSB ±2.5 LSB TO-116 (D-16) AD558KN 0 °C to +70°C ±1/4 LSB ±1 LSB Plastic (N-16) AD558KP 0 °C to +70°C ±1/4 LSB ±1 LSB PLCC (P-20A) AD558KD 0 °C to +70°C ±1/4 LSB ±1 LSB TO-116 (D-16) AD558SD –55 °C to +125°C ±3/4 LSB ±2.5 LSB TO-116 (D-16) AD558TD –55 °C to +125°C ±3/8 LSB ±1 LSB TO-116 (D-16) NOTES 1For details on grade and package offerings screened in accordance with MIL-STD-883, refer to the Analog Devices Military Products Databook or current AD558/883B data sheet. 2D = Ceramic DIP; N = Plastic DIP; P = Plastic Leaded Chip Carrier. |
同様の部品番号 - AD558TD |
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同様の説明 - AD558TD |
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