データシートサーチシステム |
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LM1084 データシート(PDF) 3 Page - Texas Instruments |
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LM1084 データシート(HTML) 3 Page - Texas Instruments |
3 / 22 page LM1084 www.ti.com SNVS037F – SEPTEMBER 1999 – REVISED MARCH 2013 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Maximum Input to Output Voltage Differential LM1084-ADJ 29V LM1084-12 18V LM1084-3.3 27V LM1084-5.0 25V Power Dissipation (3) Internally Limited Junction Temperature (TJ) (4) 150°C Storage Temperature Range -65°C to 150°C Lead Temperature 260°C, to 10 sec ESD Tolerance (5) 2000V (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery in Application Notes. (4) The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to THERMAL CONSIDERATIONS in the Application Note. (5) For testing purposes, ESD was applied using human body model, 1.5k Ω in series with 100pF. Operating Ratings (1) Junction Temperature Range (TJ) (2) Control Section −40°C to 125°C Output Section −40°C to 150°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to THERMAL CONSIDERATIONS in the Application Note. Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM1084 |
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