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ADM1275-1ARQZ データシート(PDF) 10 Page - Analog Devices |
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ADM1275-1ARQZ データシート(HTML) 10 Page - Analog Devices |
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10 / 48 page  ADM1275 Data Sheet Rev. D | Page 10 of 48 Pin No. QSOP LFCSP Mnemonic Description 12 10 SDA Serial Data Input/Output Pin. Open-drain input/output. Requires an external resistive pull-up. 13 11 SCL Serial Clock Pin. Open-drain input. Requires an external resistive pull-up. 14 12 PWRGD Power-Good Signal. Used to indicate that the supply is within tolerance. This signal is based on the voltage present on the FLB pin. 15 13 FLB Foldback Pin. A foldback resistor divider is placed from the source of the FET to this pin. Foldback is used to reduce the current limit when the source voltage drops. The foldback feature ensures that the power through the FET is not increased beyond the SOA limits. 16 14 VOUT This pin is used to read back the output voltage using the internal ADC. A 1 kΩ resistor should be inserted in series between the source of a FET and the VOUT pin. 17 15 GND Chip Ground Pin. 18 16 GATE Gate Output Pin. This pin is the high-side gate drive of an external N-channel FET. This pin is driven by the FET drive controller, which uses a charge pump to provide a pull-up current to charge the FET gate pin. The FET drive controller regulates to a maximum load current by regulating the GATE pin. GATE is held low when the supply is below UVLO. 19 17 SENSE− Negative Current Sense Input Pin. A sense resistor between the SENSE+ pin and the SENSE− pin sets the analog current limit. The hot-swap operation of the ADM1275 controls the external FET gate to maintain the sense voltage (VSENSE+ − VSENSE−). This pin also connects to the FET drain pin. 20 18 SENSE+ Positive Current Sense Input Pin. This pin connects to the main supply input. A sense resistor between the SENSE+ pin and the SENSE− pin sets the analog current limit. The hot-swap operation of the ADM1275 controls the external FET gate to maintain the sense voltage (VSENSE+ − VSENSE−). This pin is also used to measure the supply input voltage using the ADC. N/A EP EPAD Exposed Paddle on Underside of LFCSP. Solder the exposed paddle to the board to improve thermal dissipation. The exposed paddle can be connected to ground. |
同様の部品番号 - ADM1275-1ARQZ |
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同様の説明 - ADM1275-1ARQZ |
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