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BCP68 データシート(PDF) 3 Page - NXP Semiconductors |
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3 / 23 page BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 18 October 2011 3 of 23 NXP Semiconductors BCP68; BC868; BC68PA 20 V, 2 A NPN medium power transistors 3. Ordering information [1] Valid for all available selection groups. 4. Marking Table 4. Ordering information Type number[1] Package Name Description Version BCP68 SC-73 plastic surface-mounted package with increased heatsink; 4 leads SOT223 BC868 SC-62 plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads SOT89 BC68PA HUSON3 plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 2 0.65 mm SOT1061 Table 5. Marking codes Type number Marking code BCP68 BCP68 BCP68-25 BCP68/25 BC868 CAC BC868-25 CDC BC68PA AR BC68-25PA AS |
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