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TC1017-2.6VCT データシート(PDF) 2 Page - Microchip Technology |
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TC1017-2.6VCT データシート(HTML) 2 Page - Microchip Technology |
2 / 22 page TC1017 DS21813D-page 2 © 2005 Microchip Technology Inc. 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Input Voltage ....................................................................6.5V Power Dissipation ......................... Internally Limited (Note 7) Maximum Voltage On Any Pin ..................VIN + 0.3V to -0.3V † Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. PIN FUNCTION TABLE Name Function SHDN Shutdown control input. NC No connect GND Ground terminal VOUT Regulated voltage output VIN Unregulated supply input ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 µA, CL = 1.0 µF, SHDN > VIH, TA = +25°C Boldface type specifications apply for junction temperatures of –40°C to +125°C. Parameter Sym Min Typ Max Units Test Conditions Input Operating Voltage VIN 2.7 — 6.0 V Note 1 Maximum Output Current IOUTMAX 150 —— mA Output Voltage VOUT VR – 2.5% VR ±0.5% VR + 2.5% V Note 2 V OUT Temperature Coefficient TCVOUT — 40 — ppm/°C Note 3 Line Regulation |(ΔVOUT/ΔVIN)| / V R —0.04 0.2 %/V (VR + 1V) < VIN < 6V Load Regulation (Note 4) |ΔVOUT| / VR —0.38 1.5 %IL = 0.1 mA to IOUTMAX Dropout Voltage (Note 5) VIN – VOUT — — — — 2 90 180 285 — 200 350 500 mV IL = 100 µA IL = 50 mA IL = 100 mA IL = 150 mA Supply Current IIN —53 90 µA SHDN = VIH, IL = 0 Shutdown Supply Current IINSD — 0.05 2 µA SHDN = 0V Power Supply Rejection Ratio PSRR — 58 — dB f =1 kHz, IL = 50 mA Wake-Up Time (from Shutdown Mode) tWK —10 — µs VIN = 5V, IL = 60 mA, CIN = COUT =1 µF, f = 100 Hz Note 1: The minimum V IN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ (VR + 2.5%) + VDROPOUT. 2: V R is the regulator voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 3.0V. 3: 4: Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value at a 1V differential. 6: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for t = 10 msec. 7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., T A, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.1 “Thermal Shutdown”, for more details . 8: Output current is limited to 120 mA (typ) when V OUT is less than 0.5V due to a load fault or short-circuit condition. TCV OUT V OUTMAX V OUTMIN – () 10 6 × V OUT T Δ × -------------------------------------------------------------------------------------- = |
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