LM3263

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SNVS837A – JUNE 2013 – REVISED AUGUST 2013

LM3263 High-Current Step-Down DC-DC Converter with MIPI® RF Front-End

Control Interface for RF Power Amplifiers

Check for Samples: LM3263

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FEATURES

DESCRIPTION

The LM3263 is a DC-DC converter optimized for

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powering multi-mode multi-band RF power amplifiers

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High-Efficiency PFM and PWM Modes with

(PAs) from a single Lithium-Ion cell. The LM3263

Internal Seamless Transition

steps down an input voltage from 2.7V to 5.5V to a

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Operates from a Single Li-Ion Cell: 2.7V to 5.5V

dynamically adjustable output voltage of 0.4V to 3.6V.

The output voltage is externally programmed through

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Dynamically Adjustable Output Voltage: 0.4V

the RFFE Digital Control Interface and is set to

to 3.6V (typ.) in PFM and PWM Modes

ensure efficient operation at all power levels of the

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2.5A Maximum Load Current in PWM Mode

RF PA.

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2.7 MHz (typ.) Switching Frequency

The LM3263 operates in modulated frequency PWM

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ACB (reduces inductor requirements and size)

mode producing a small and predictable amount of

output voltage ripple. PWM mode enables best

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Internal Compensation

meeting power requirements and stringent spectral

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Current and Thermal Overload Protection

compliance, with the minimal amount of filtering and

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16-bump DSBGA Package

excess headroom. When operating in PFM mode, the

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LM3263 enables the lowest current consumption

across PA output power level settings and therefore

maximizes system efficiency.

APPLICATIONS

The LM3263 has a unique Active Current assist and

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Smartphones

analog Bypass (ACB) feature to minimize inductor

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RF PC Cards

size without any loss of output regulation for the

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Tablets, eBook Readers

entire battery voltage and RF output power range,

until dropout. ACB provides a parallel current path,

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Handheld Radios

when needed, to limit the maximum inductor current

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Battery-Powered RF Devices

to 1.45A (typ) while still driving a 2.5A load. The

analog bypass feature also enables operation with

minimal dropout voltage.

The LM3263 is available in a small 2 mm x 2 mm

chip-scale 16-bump DSBGA package.

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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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MIPI is a registered trademark of Mobile Industry Processor Interface Alliance.

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All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Copyright © 2013, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.