CYStech Electronics Corp.

Spec. No. : C240M3

Issued Date : 2013.02.19

Revised Date :

Page No. : 8/8

BTB772AJ3

CYStek Product Specification

TO-252AA Dimension

Inches

Millimeters

Marking:

Style: Pin 1.Base 2.Collector 3.Emitter

4.Collector

3-Lead TO-252AA Plastic Surface Mount Package

CYStek Package Code: J3

Device

Name

Date

Code

B772A

□□

1

2

3

4

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.087

0.094

2.200

2.400

e

0.086

0.094

2.186

2.386

A1

0.000

0.005

0.000

0.127

e1

0.172

0.188

4.372

4.772

B

0.039

0.048

0.990

1.210

H

0.163 REF

4.140 REF

b

0.026

0.034

0.660

0.860

K

0.190 REF

4.830 REF

b1

0.026

0.034

0.660

0.860

L

0.386

0.409

9.800

10.400

C

0.018

0.023

0.460

0.580

L1

0.114 REF

2.900 REF

C1

0.018

0.023

0.460

0.580

L2

0.055

0.067

1.400

1.700

D

0.256

0.264

6.500

6.700

L3

0.024

0.039

0.600

1.000

D1

0.201

0.215

5.100

5.460

P

0.030 REF

0.750 REF

E

0.236

0.244

6.000

6.200

V

0.211 REF

5.350 REF

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead : Pure tin plated.

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.