CYStech Electronics Corp.

Spec. No. : C575H8

Issued Date : 2012.05.09

Revised Date :2012.11.12

Page No. : 9/11

MTB02N03H8

CYStek Product Specification

DFN5×6 Dimension (C Forming)

Marking :

8-Lead DFN5×6 Plastic Package

CYS Package Code : H8

Device

Name

B02

N03

Date Code

Millimeters

Inches

Millimeters

Inches

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.900

1.000

0.035

0.039

k

1.190

1.390

0.047

0.055

A3

0.254 REF

0.010 REF

b

0.350

0.450

0.014

0.018

D

4.944

5.096

0.195

0.201

e

1.270 TYP.

0.050 TYP.

E

5.974

6.126

0.235

0.241

L

0.559

0.711

0.022

0.028

D1

3.910

4.110

0.154

0.162

L1

0.424

0.576

0.017

0.023

E1

3.375

3.575

0.133

0.141

H

0.574

0.726

0.023

0.029

D2

4.824

4.976

0.190

0.196

θ

10°

12°

10°

12°

E2

5.674

5.826

0.223

0.229

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: Pure tin plated.

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.