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C-1001G データシート(PDF) 6 Page - PARA LIGHT ELECTRONICS CO., LTD. |
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C-1001G データシート(HTML) 6 Page - PARA LIGHT ELECTRONICS CO., LTD. |
6 / 11 page 1.00 INCH SINGLE DIGIT DISPLAY C-1001G G/W REV:A / 0 —SOLDERING METHOD SOLDERING CONDITIONS REMARK DIP SOLDERING Bath temperature: 260 max Immersion time: within 5 sec — Solder no closer than 2mm from the base of the package — Using soldering flux, ” RESIN FLUX” is recommended. SOLDERING IRON Soldering iron: 30W or smaller Temperature at tip of iron: 360 or lower ℃ Soldering time: within 3 sec. — During soldering, take care not to press the tip of iron against the PIN. (To prevent heat from being transferred directly to the PIN.) 1) When soldering the PIN of Display in a jig that the package is fixed with a panel (See fIg.1), be careful not to stress the PIN with iron tip. When soldering Display in a condition that the package is fixed with a panel, be careful not to cling and stress the surface of Display on the panel to avoid damaging the Display. Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin & copper and silver is proposed with the temperature of Celsius 260. The proportion of the alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly 3 seconds. DRAWING NO. : DS-11-09-0154 DATE : 2009-09-25 Page : 6 Fig.1 Release by PARALIGHTDCC |
同様の部品番号 - C-1001G |
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同様の説明 - C-1001G |
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